Advanced Optical Packaging Design Tech Lead

Advanced Optical Packaging Design Tech Lead Location: San Jose, CA (4 days onsite)
We are partnering with a leading semiconductor company to hire an Advanced Optical Packaging Design Tech Lead to join a newly formed, high-impact engineering team focused on next-generation optical and optoelectronic systems.
This is a senior individual contributor role with significant technical ownership, focused on defining and delivering advanced packaging architectures for optical engines, silicon photonics products, and co-packaged optics platforms. The position sits at the intersection of package design, high-speed interconnects, and manufacturable system integration.
The RoleYou will play a central role in defining package architecture and driving the development of advanced optical packaging solutions from concept through to production. This position requires deep technical expertise, strong cross-functional leadership, and the ability to operate at a senior staff / principal level.
Key responsibilities include:

• Define package architecture and technology direction for advanced optical and optoelectronic products
• Lead substrate design, including stack-up definition, routing topology, via strategy, impedance control, and manufacturability trade-offs
• Drive electrical, mechanical, thermal, and optical co-design to achieve robust system performance
• Lead development and integration of hybrid bonding solutions for fine-pitch die integration
• Establish methodologies for warpage analysis, thermo-mechanical modeling, and package reliability
• Own signal integrity strategy for high-speed package and substrate interconnects
• Define scalable design rules and interconnect architectures across multiple product generations
• Partner closely with IC, PIC, systems, packaging, reliability, and manufacturing teams to drive execution
• Work with OSATs, foundries, and substrate suppliers to enable production-ready solutions
• Lead root-cause analysis for performance, yield, and reliability issues
• Mentor engineers and contribute to technical direction and engineering best practices

Requirements

• Master’s or PhD in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field
• 10+ years of experience in advanced semiconductor or optoelectronic packaging
• Strong experience in package architecture and substrate design
• Hands-on experience with hybrid bonding technologies
• Solid background in thermo-mechanical behavior, warpage analysis, and material interactions
• Strong understanding of signal integrity for high-speed interconnects at the package/substrate level
• Experience defining stack-ups, routing strategies, and design-for-manufacturability requirements
• Proven track record of driving packaging solutions from concept through prototype, qualification, and production
• Strong cross-functional leadership across design, reliability, manufacturing, and external partners

Preferred Experience

• Silicon photonics, co-packaged optics, or optical module development
• Optical assembly techniques (fiber attach, laser integration, photodiodes, alignment methods)
• AI networking or high-speed interconnect hardware
• Experience with tools such as Cadence APD/Allegro, ANSYS, HFSS, CST, COMSOL, or similar
• 2.5D / 3D integration, chiplets, or fine-pitch interconnect technologies
• Experience working with OSATs, foundries, and substrate suppliers

Additional Information

• This is a senior individual contributor role at a tech lead / principal level
• Candidates must be willing to work onsite in San Jose 4 days per week
• Relocation support is available
• H1B transfer support is available

Why Apply?This is an opportunity to join a newly established team and play a key role in shaping advanced optical packaging solutions for next-generation products. The role offers strong technical ownership, cross-functional influence, and the ability to impact both architecture and production execution in a high-performance engineering environment.
If you have deep experience in advanced packaging and are looking to work at the forefront of optical and high-speed interconnect technologies, this is a strong opportunity to step into a high-impact technical leadership role.
INTERESTED? We are committed to submitting suitable candidates for this vacancy to our client ASAP, for more information, contact Renz Moreno at PER Recruitment or send your CV to renz@per-international.com